I-PSiP (I-Power Supply in Package) ukunikezwa kwamandla ebhodini: Ukusebenzisa ubuchwepheshe bokupakisha be-semiconductor ukuze kwakhiwe iphakethe lamandla le-PSiP elikhulu kakhulu
Ngokuphindaphindeka kokusetshenziswa kwamandla kwemishini, ukuphikisana phakathi kwamandla nevolumu kuya ngokuya kugqama.
Ukusakaza bukhoma, ividiyo, imidlalo kanye namanye amabhizinisi anamandla ekhompiyutha aphezulu ukukhuthaza ukuthuthukiswa kusuka ku-CPU kuya ku-CPU + XPU, ukusetshenziswa kwamandla we-chip kukhuphuke ngamaphesenti angaphezu kuka-50, ukusetshenziswa kwamandla eseva yesiphakeli sonke kwandise kakhulu i-motherboard yeseva.
Ukunikezwa kwamandla ebhodi.
Ivolumu ye-motherboard ayinyuki.
Amandla okunikezwa kwamandla aphindwe kabili, ivolumu yesisindo esifanayo samandla senyuke ngo-80%.
Ukupakishwa kwe-PCB okudidiyelwe kakhulu kanye nobuchwepheshe bokucubungula i-surface-mount, ukuminyana kwamandla okuphakela ebhodini kukhuphuka ngo-70%
Ukunikezwa kwamandla kochungechunge lwe-PSiP: 10~100W
Idizayini edidiyelwe ye-Semiconductor y izinzuzo zokunciphisa izinga lokuhluleka:
- Ifilosofi ye-Semiconductor design/flow/standard design power supply
- Kuthembeke kakhulu, uthuli, umswakama kanye nosawoti ukumelana nesifutho
- Ukukhiqizwa okuzenzakalelayo ngokugcwele ngo-99.9%+ ngokuqondile ngesilinganiso
Isikhathi sokuthumela: Aug-25-2023
